What is the status of Submer Barcelona AI data center?
Submer Barcelona AI data center is tracked as planned. It was announced on February 28, 2025, and the public record should not be interpreted as a later project stage without new evidence.
Facility development • Deployment
Submer announced a 56 MW owned and operated liquid-cooled data center in Barcelona as a showcase for its facility platform.
Project brief
Submer says the Barcelona project will combine facility design, construction, liquid cooling, and AI infrastructure services. The announced design targets 150 kW or more per rack or tank and zero operational water use. Detailed construction milestones and an opening date were not included in the announcement.
Status is labeled from public evidence. Supplier orders, MoUs, pilots, projects under delivery, and operating sites are not counted as equivalent.
Connected records
Connected records
A liquid loop moves heat from processor-mounted cold plates to a CDU and then to facility heat rejection.
Servers operate submerged in a dielectric liquid that remains in the liquid phase while carrying heat to a heat exchanger.
A facility combines liquid capture at high-heat components with air cooling for the rest of the rack.
Connected records
CDUs control flow, pressure, temperature, water quality, and heat exchange between facility and technology cooling loops.
Fluid vessels, power distribution, networking, and heat exchange assembled to operate submerged computing hardware.
Evidence ledger
Profiles distinguish company-reported claims from confirmed operating data. Open the original materials before relying on a specification.
Submer · Feb 28, 2025
Direct answers
Concise answers generated from the structured record and its cited evidence.
Submer Barcelona AI data center is tracked as planned. It was announced on February 28, 2025, and the public record should not be interpreted as a later project stage without new evidence.
The source-reported capacity is 56 MW. The project is located in Barcelona, Spain.
The record connects the project to Direct To Chip, Single Phase Immersion, Hybrid Cooling.