Technology library
Technologies
The architectures moving heat from AI silicon to facility heat rejection—without the marketing fog.
Direct-to-chip liquid cooling
A liquid loop moves heat from processor-mounted cold plates to a CDU and then to facility heat rejection.
Single-phase immersion cooling
Servers operate submerged in a dielectric liquid that remains in the liquid phase while carrying heat to a heat exchanger.
Two-phase direct-to-chip cooling
A dielectric working fluid boils at a processor cold plate and condenses elsewhere in a sealed loop.
Data-center heat reuse
Recovered server heat is upgraded or transferred for district heating, buildings, industrial processes, or other useful loads.
Dry cooling
Air-cooled heat exchangers reject heat without evaporating process water during normal operation.
Evaporative cooling
Water evaporation lowers air or process-fluid temperature before heat is rejected from the data center.
Hybrid air and liquid cooling
A facility combines liquid capture at high-heat components with air cooling for the rest of the rack.
Precision liquid cooling
A sealed chassis-level approach that brings dielectric coolant close to components without filling a shared immersion tank.
Rear-door heat exchangers
A liquid-fed heat exchanger replaces or attaches to the rear rack door and captures heat from server exhaust.
Two-phase immersion cooling
Electronic components boil a dielectric fluid inside a sealed tank; vapor condenses and returns to the bath.