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Project database
Check what is operating, deploying, piloting, or merely planned—and see the public evidence that supports each status.
Use this section to decide
Is this system operating, being installed, piloting, or only announced?
What capacity, rack density, compute, and cooling architecture are public?
What evidence would be needed before treating the project as proven?
Featured records first, then the section's own editorial order.
| Record | Stage | Operator | Location | Architecture | Suppliers | Capacity | Rack density | Compute | Announced | Fields addressed | Evidence | Sources | Reviewed | Comparison |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| DarkNX Ontario AI campus | Planned | DarkNX | Ontario, Canada | Two Phase Direct To Chip | 2 | 300 MW planned; first phase two × 65 MW | Not disclosed | AI and high-density GPU workloads | 2025-11-17 | 9/9 | Supplier reported | 1 |
| Madhya Pradesh–Submer AI capacity program | Planned | Government of Madhya Pradesh and Submer | Madhya Pradesh, India | Direct To Chip, Single Phase Immersion +1 | 1 | Up to 1 GW under a memorandum of understanding | Not disclosed | AI-ready data centers | 2025-07-28 | 9/9 | Supplier reported | 1 |
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| Equinix Ashburn NeuCool deployment | Operating | Equinix | Ashburn, Virginia, United States | Two Phase Direct To Chip | 1 | IR80 demonstration system | Not disclosed | Co-innovation and customer validation | 2025-07-15 | 9/9 | Supplier reported | 1 |
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| SoftBank–Foxconn H200 rack cooling pilot | Pilot | SoftBank | Japan | Two Phase Direct To Chip | 1 | One rack-scale demonstration | Not disclosed | NVIDIA H200 GPUs | 2025-05-21 | 9/9 | Supplier reported | 1 |
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| Submer Barcelona AI data center | Planned | Submer | Barcelona, Spain | Direct To Chip, Single Phase Immersion +1 | 1 | 56 MW | 150 kW+ per rack or tank (design target) | AI infrastructure | 2025-02-28 | 9/9 | Supplier reported | 1 |
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| LiquidStack 300 MW U.S. multi-site order | Deploying | Undisclosed U.S. data-center operator | Multiple sites, United States | Direct To Chip, Hybrid Cooling | 1 | 300 MW aggregate CDU capacity | Not disclosed | AI-ready, high-density infrastructure | 2025-01-06 | 9/9 | Supplier reported | 1 |
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